Dear All:

We have a question regarding our sealed electronic package. We are using a welded and soldered metal package to ensure no significant moisture/water vapour ingress during the lifetime of the product. This includes a glass to metal seal. Unfortunately, in our trials, we have found by Helium diffusion leak test that some of the glass seals can crack, so we want to use an epoxy material to seal any possible cracks. We would like some help in estimating the likely diffusion of water vapour through the epoxy, the influence of the adhesion between (particle filled) epoxy and the glass, and the possible effect on the product lifetime.

Regards,
Ronald Anderson

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